Edit 19/9: There's now an interesting dicussion on this NYT article at Slashdot - my normal practice is to browse comments at a threshold of 4, but whatever does it for you...
According to the New York Times, a research collaboration between Intel and the University of California, Santa Barbara, has borne fruit, allowing them to transfer data between chips over laser instead of wires. This advance in technology will allow a greater density of chips in system designs, with a faster rate of transfer between the chips.
Aspects of this technology are already in general use, particularly when transmitting data over long distances using fibre optic cable. There's probably any number of mind-boggling applications (particularly in parallel processing) but I can yet find any further information from Intel or UCSB.
It has reminded me that I need to check into Intel's Technology and Research page more often. They have got some really funky stuff going on over there.
I don't expect to see this enter the consumer desktop market any time this decade, but that suits me fine. I have enough problems with core envy. I don't need to add laser envy to the mix as well.